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Program Value

Relying on leading solutions, we can manufacture "reliable + durable" innovative products, explore the problems of accelerating the efficiency and benefits of adhesive application in electronic manufacturing industry, and help build a new future of adhesive industry.
Mobile Phone
Mobile Phone
The adhesive application of smart phones depends on two links: product scheme design and machine manufacturing. Two modes are derived, namely, the designation of the solution provider and the decision of the manufacturer.

Ancham advocates the service mechanism of customer participation in the whole process. We provide support for you in the whole product development process to find the adhesive solution that best suits your needs.

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01 Sensor structure bonding

Recommended Models

01 Sensor structure bonding

PUR hot-melt adhesives

02 Bonding of Screen

Recommended Models

02 Bonding of Screen

PUR hot-melt adhesives

03 Camera substrate bonding

Recommended Models

03 Camera substrate bonding

Two-component epoxy structural adhesives

04 PCB coating

Recommended Models

04 PCB coating

Polyurethane conformal coating

05 Bonding of cover

Recommended Models

05 Bonding of cover

PUR hot-melt adhesives

06 Flat engine wiring bonding

Recommended Models

06 Flat engine wiring bonding

Acrylic UV curing adhesives

07 FPC stiffener film

Recommended Models

07 FPC stiffener film

Acrylic UV curing adhesives

08 Speaker Acoustic cavity cover bonding

Recommended Models

08 Speaker Acoustic cavity cover bonding

PUR hot-melt adhesives

09 Bonding of NFC/Wireless Charging Graphite Chip

Recommended Models

09 Bonding of NFC/Wireless Charging Graphite Chip

One-component silicone sealants

Tablet
Tablet
平板电脑与电纸书在生过程产中存在较多重合工序,胶粘材料的应用集中于整机装配过程,如屏幕面板、结构粘接、缓冲、密封,以及手写笔的粘接等。
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01 Camera substrate bonding

Recommended Models

01 Camera substrate bonding

Two-component epoxy structural adhesives

02 Bonding of Screen frame

Recommended Models

02 Bonding of Screen frame

PUR hot-melt adhesives

03 Sensor structure bonding

Recommended Models

03 Sensor structure bonding

PUR hot-melt adhesives

04 PCB coating

Recommended Models

04 PCB coating

Polyurethane conformal coating

05 FPC&antenna bonding

Recommended Models

05 FPC&antenna bonding

Acrylic UV curing adhesives

06 Speaker Acoustic cavity cover bonding

Recommended Models

06 Speaker Acoustic cavity cover bonding

PUR hot-melt adhesives

07 stylus pen bonding

Recommended Models

07 stylus pen bonding

One-component silicone sealants

Wireless Charge
Wireless Charge
The panel and shell are fixed with pur hot melt adhesive, and the coil part is fixed with one component room temperature curing silicone, which can provide the possibility of stable fixation and lightweight design.
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01 Bonding of charging panel

Recommended Models

01 Bonding of charging panel

PUR hot-melt adhesives

02 Bonding of charging coil

Recommended Models

02 Bonding of charging coil

One-component silicone sealants

03 Bonding of induction coil and metal heat dissipation plates

Recommended Models

03 Bonding of induction coil and metal heat dissipation plates

One-component thermal conductive silicone adhesives

04 Bonding of shield

Recommended Models

04 Bonding of shield

One-component thermal conductive silicone adhesives

05 PCB coating

Recommended Models

05 PCB coating

Acrylic UV curing conformal coating

06 Adhesion of adsorption magnetic ring

Recommended Models

06 Adhesion of adsorption magnetic ring

Acrylic UV curing adhesives

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