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Program Value

Relying on leading solutions, we can manufacture "reliable + durable" innovative products, explore the problems of accelerating the efficiency and benefits of adhesive application in electronic manufacturing industry, and help build a new future of adhesive industry.
Mobile Phone
Mobile Phone
The adhesive application of smart phones depends on two links: product scheme design and machine manufacturing. Two modes are derived, namely, the designation of the solution provider and the decision of the manufacturer.

Ancham advocates the service mechanism of customer participation in the whole process. We provide support for you in the whole product development process to find the adhesive solution that best suits your needs.

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01 Sensor structure bonding

Recommended Models

AP9306

01 Sensor structure bonding

PUR hot-melt adhesive

02 Bonding of Screen frame

Recommended Models

AP9108 AP9110

02 Bonding of Screen frame

PUR hot-melt adhesive

03 Camera module bonding

Recommended Models

AE1401

03 Camera module bonding

Underfill epoxy

04 PCB coating

Recommended Models

AP9502

04 PCB coating

Polyurethane conformal coating adhesive

05 Bonding of cover and frame

Recommended Models

AP9308 AP9312 AP9315

05 Bonding of cover and frame

PUR hot-melt adhesive

06 Chip filling

Recommended Models

AE1401

06 Chip filling

Underfill epoxy

07 Vibration engine bonding

Recommended Models

AS3105

07 Vibration engine bonding

RTV silicone

08 FPC bonding

Recommended Models

AC5705-HV

08 FPC bonding

Acrylic UV cure adhesive

09 Speaker bonding

Recommended Models

AP9108

09 Speaker bonding

PUR hot-melt adhesive

10 Bonding of wireless charging module

Recommended Models

AS3103 AS3110

10 Bonding of wireless charging module

RTV silicone

Tablet
Tablet
平板电脑与电纸书在生过程产中存在较多重合工序，胶粘材料的应用集中于整机装配过程，如屏幕面板、结构粘接、缓冲、密封，以及手写笔的粘接等。
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01 Camera module bonding

Recommended Models

AE1401

01 Camera module bonding

Underfill epoxy

02 Bonding of Screen frame

Recommended Models

AP9108 AP9110

02 Bonding of Screen frame

PUR hot-melt adhesive

03 Sensor structure bonding

Recommended Models

AP9306

03 Sensor structure bonding

PUR hot-melt adhesive

04 PCB coating

Recommended Models

AP9502

04 PCB coating

Polyurethane conformal coating adhesive

05 FPC&antenna bonding

Recommended Models

AC5705-HV

05 FPC&antenna bonding

Acrylic UV cure adhesive

06 Chip filling

Recommended Models

AE1401

06 Chip filling

Underfill epoxy

07 Speaker bonding

Recommended Models

AP9108

07 Speaker bonding

PUR hot-melt adhesive

08 stylus pen bonding

Recommended Models

AS3103 AS3110

08 stylus pen bonding

RTV silicone

Wireless Charge
Wireless Charge
The panel and shell are fixed with pur hot melt adhesive, and the coil part is fixed with one component room temperature curing silicone, which can provide the possibility of stable fixation and lightweight design.
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01 Bonding of charging panel

Recommended Models

AP9108 AP9110

01 Bonding of charging panel

PUR hot-melt adhesive

02 Bonding of charging coil

Recommended Models

AS3103 AS3110

02 Bonding of charging coil

RTV silicone

03 Bonding of induction coil and shielding ring

Recommended Models

AS3103 AS3110

03 Bonding of induction coil and shielding ring

RTV silicone

04 Bonding of shield

Recommended Models

AS3108 AS3110

04 Bonding of shield

RTV silicone

05 PCB coating

Recommended Models

AC5525 AC5540

05 PCB coating

Acrylic UV conformal coating adhesive

06 Adhesion of adsorption magnetic ring

Recommended Models

AC5102 AC5105

06 Adhesion of adsorption magnetic ring

Acrylic UV cure adhesive

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