Ancham technology of adhesives helps our customers meet some of the more complex challenges

AS42(04) is a two-component thermal conductive silicone gel that can cure at room temperature or under heating conditions. Used as a heat transfer medium for cooling electronic devices. It can be cured in place to form a soft elastomer, which does not cause stress on electronic components. After solidification, it closely adheres to its contact surface to reduce thermal resistance, which is more conducive to the heat conduction between the heat source and its surrounding heat sinks, motherboard, metal shell, and outer shell.

■ Thermal conductivity: 4.0W/m·K.
■ 100% solid, no exudate after curing.
■ Low stress provides more effective protection for electronic components and chips.
■ Superior high and low temperature resistance, excellent weather resistance, radiation resistance, and superior dielectric performance.
■ Flame retardancy meets UL94-V0.
■ Compliant with ROHS.