Ancham technology of adhesives helps our customers meet some of the more complex challenges

AE1702 is specifically designed for precision electronic component packaging such as CSP and BGA. As a single-component epoxy resin-based underfill adhesive, it enhances solder joint reliability through micron-level gap filling technology. Its low-viscosity fluid characteristic allows it to quickly penetrate the tiny gaps between the chip and the substrate through capillary action. This product achieves efficient curing under medium to high temperature conditions. After curing, it effectively mitigates the damage to solder joints caused by thermal cycling stress and mechanical impact, significantly enhancing the flexibility of chip packaging processes and the stability of chip modules.

■ Single-component, easy to operate.
■ Rapid curing at medium to high temperatures.
■ Yizhong Heavy Industry.
■ Compatible with most lead-free solder.
■ High reliability.
■ Complies with RoHS, REACH, and halogen regulations.