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Ancham technology of adhesives helps our customers meet some of the more complex challenges

Product Overview

Product Overview

Two-component thermal conductive epoxy potting, which can cure at room temperature or heating conditions, has good thermal conductivity and excellent insulation performance, low viscosity, good fluidity, and can meet small gap sealing applications.

Product Applications

Suitable for packaging and protection applications of precision electronic products.
Product Features

Good fluidity

Low viscosity and good fluidity.

Universal

Has good adhesion and bonding strength to various materials.

Ageing resistance

Excellent electrical insulation,Thermal shock resistance, and ageing resistance.
Product List
Product Model Color Mixing Ratio Viscosity Hardness Cure Mechanism Thermal Conductivity More Parameters
AE22(07) Black 5:12500±500 mPa.s
@ 25℃		85±5
Shore D		3~5h Initial Curing Time
24h Complete Curing Time		0.7W/m·K Detailed introduction
AE22(10) Black 10:14000±1000 mPa.s
@ 25℃		85±5
Shore D		3~5h Initial Curing Time
24h Complete Curing Time		1.0W/m·K Detailed introduction
AE22(11) Black 10:112500±2500 mPa.s
@ 25℃		90±5
Shore D		24~48h Complete Curing Time1.1W/m·K Detailed introduction

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