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Ancham technology of adhesives helps our customers meet some of the more complex challenges

Product Overview

Product Overview

The product exhibits good fluidity and is suitable for underfill protection of CSP/BGA components in intermediate and extremely small gaps.

Product Applications

Primarily used in various CSP/BGA underfill applications, it provides excellent protection against mechanical shock and aging impact for BGA or CSP components.
Product Features

Fast curing

Fast curing.

Impact resistance

After curing, it can effectively alleviate the damage to solder joints caused by thermal cycling stress and mechanical impact.

Environmental compliance

Complies with RoHS, REACH, and halogen regulations.
Product List
Product Model Color Viscosity Proportion Hardness Cure Mechanism Dielectric Strength Temperature Lap Shear Strength CTE More Parameters
AE1702 Black 2500±500 mPa.s
@ 25℃		1.15±0.05 g/cm³
@ 25℃		85±5
Shore D		10~20min @ 120℃
5~10min @ 150℃		＞20 kV/mm-40~150℃20MPa(Steel)90×10^-6/ ℃
@ -40~150℃		 Detailed introduction

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