Heating and rapid curing, after curing, it has excellent high temperature resistance, chemical corrosion resistance, and electrical insulation. It has good adhesion to materials such as metals and ceramics, and can meet the requirements of low stress electronic packaging.
■ Packaging of high-power semiconductor modules. ■ The sealing application of controllers, sensors, and capacitors in electronic and electrical equipment. ■ Sealing of small and medium-sized electronic components. ■ Power filter encapsulation.
Product Model | Color | Mixing Ratio | Viscosity | Operation Time | Cure Mechanism | Lap Shear Strength | More Parameters |
---|---|---|---|---|---|---|---|
AE22(03) | Black | 4:1 | 2000±500 mPa.s @ 25℃ | 60~80min @ 25℃ | 24h Initial Curing Time @ 25℃ 72h Complete Curing Time @ 25℃ 2~3h Complete Curing Time @ 80℃ | 7MPa Steel (grit blasted) |
Detailed introduction |
AE23(15) | Dark grey | 17:10 | 120±20 Pa.s @ 25℃ | 8h @ 25℃ | 125°C/2h+165°C/2h | >25MPa Steel (grit blasted) |
Detailed introduction |