Two-component epoxy adhesives have become indispensable key materials in the electronic and electrical industry, thanks to their excellent bonding strength, superior electrical insulation properties and good chemical stability. The rapid popularization of emerging technologies such as new energy vehicles, 5G communication, and the Internet of Things has led to increasing performance requirements forhesives. By 2025, the consumption of epoxy adhesives in the electronic and electrical field is expected to reach 168,000 tons, with a compound annual growth rate of more than 15%.
Currently, the main applications of epoxy resin adhesives in the field of electronic appliances include:
1. PCB packaging and protection: used for bonding and fixing copper clad boards and electronic components to prevent loosening and falling off, and also as a three-proof (waterproof, mildew-proof,-fog proof) coating to improve the reliability of the circuit board.
2. Chip packaging: protects IC chips from mechanical damage, humidity, and chemical corrosion, improves stability and is suitable for packaging forms such as BGA, COB, COG, etc.
3. Conductive/thermal bonding: conductive silver paste is used for conduct connection of components such as LEDs and sensors; high thermal conductivity epoxy adhesive is used for heat dissipation bonding of power devices (such as IGBTs, MOS tubes).
4.Structural bonding: fix the housing, heat sink, battery pack, etc., replace screws or welding, and achieve lightweight design.
一. Core Advantages and Technical Features of AE2163
1.AE2163 has the following core advantages in electronic and electrical applications:1. Excellent bonding performance: It has outstanding bonding performance for materials such as aluminum, steel, composite metals, etc., meeting the high-strength fixing needs of electronic structural parts.
2. Excellent electrical insulation: provides reliable insulation protection for electronic components, preventing the risk of short circuits and electric leakage.
3. Wide temperature range capability: Operating temperature range from -40℃ to 150℃, suitable for the working environment of the vast majority of devices, whether it is a chip running at high temperature or an outdoor electronic component at low temperature, it can maintain stable performance.
4. Excellent oil and chemical resistance: Outstanding oil resistance, strong resistance to acids, alkalis, and solvents, suitable for use in complex industrial. 5. Environmental compliance: Complies with RoHS, REACH, and halogen regulations, meeting global environmental standards, suitable for the manufacture of exported electronic products.
6. Impact resistance: After curing, it has good impact resistance, which can effectively protect precision electronic components from damage caused by vibration and collision.
Technical features:
1. Curing flexibility: can be cured at room temperature (25℃) or under heated conditions, with a completeuring time of 24-48 hours at room temperature and only 50-60 minutes at 80℃, adapting to different production cycles.
2.ate working time: 40-60 minutes of working time at 25℃, providing sufficient time window for glue application and assembly.
3. Thixot system design: a unique thixotropic system ensures precise control during glue application, maintaining excellent adhesion of the glue body even under vertical or inverted working conditions, avoiding s phenomenon.
4. Physical property balance: Mixture viscosity 100 ± 20 Pa·s, specific gravity 1.26 ± 005 g/cm³, hardness Shore D 85 ± 5, tensile strength ≥ 20 MPa, elongation at break ≥ 2%, comprehensive performance is excellent.
5. Low shrinkage rate: Low volume shrinkage during curing, maximum retention of the original size of the components, no deformation or displacement suitable for high-precision scenarios such as chip packaging and circuit board reinforcement.
二.Application Direction of Ancham AE2163 in the Field of Electronic and Electrical Products
1. Transformer and Inductor Components
• Core Insulation and Bonding: Utilizing excellent electrical insulation properties, it ensures the insulation between transformer core chips, preventing eddy current loss.
• Coil Fix and Encapsulation: High bonding strength (stainless steel/stainless steel ≥15MPa) ensures the structural stability of the winding under the impact of short-circuit current.
• Application in Oil-resistant Environment: Suitable for the bonding and sealing of internal components of oil-immersed transformers.
2. Electronic and electrical structural parts
• Bonding of metal structural parts: Outstanding bonding performance for materials such as aluminum, steel, and composite metals replacing traditional mechanical connection methods.
• Fixing of impact-resistant parts: Maintain bonding reliability in a vibrating environment, suitable for moving parts such as motors and fans.
• Assembly of precision components: The thixotropic property ensures precise application, suitable for the accurate positioning of miniaturized electronic components;
3. High insulation requirement components
• High voltage insulation parts: insulation strength >15kV/mm, suitable for high voltage switch, insulator and high voltage electrical components.
• Local insulation of circuit board: volume resistivity 5.12×10¹⁵ Ω.cm, providing reliable circuit insulation protection.
• Weather-resistant sealing: operating temperature -40/ 150℃, adapting to the temperature change of outdoor electronic equipment;
4. Special environmental applications
• Oil-resistant electronic equipment: bonding and sealing in automotive electronics, industrial control equipment, etc., in the presence of contamination.
• Wide temperature range equipment: structural fixing in extreme temperature environments such as aerospace electronics, outdoor communication equipment, etc.
• Products meeting environmental requirements: comply with RoHS, REACH, halogen regulations, and meet the environmental requirements for export to the European and American markets;
Ancham AE2163 two-component epoxy resin adhesive, with its excellent comprehensive performance, has broad application prospects in the electronic and electrical industry The product's outstanding bonding performance for metal materials, excellent electrical insulation characteristics, wide temperature range working capability, and environmental compliance make it an ideal choice for key applications such as fixation of electronic structural parts, transformer insulation bonding, and circuit board protection.