Ancham technology of adhesives helps our customers meet some of the more complex challenges

mainly used in all kinds of CSP, BGA bottom filling, can provide BGA or CSP elements with excellent mechanical impact protection and aging impact protection, good flowablity at room temperature.
CSP element for medium and small gaps.

Fast curing speed; 
Excellent performance to mechanical impact and thermal shock; 
Good flowability at room temperature, suitable for automatic production.