One-component epoxy adhesive with fast curing at high temperature and excellent adhesion and bond strength. Excellent high temperature resistance, very small coefficient of thermal expansion and volume shrinkage for SMT reflow/wave soldering processes. It has excellent resistance to thermal shock and heat aging, and is used for bonding high-temperature materials such as metals and ceramics.
■ One-component, high temperature fast curing. ■ High bonding strength and strong adhesion. ■ Excellent temperature and high temperature performance. ■ Impact resistance and aging resistance. ■ Good electrical insulation performance.