One-component epoxy adhesive with fast curing at high temperature, high adhesion and excellent bond strength. Excellent adhesion to metals, ceramics and some rigid plastics. It has good electrical insulation properties and is suitable for SMT soldering front section component mounting.
■ One-component, high temperature fast curing. ■ High bonding strength and strong adhesion. ■ Wide range of applicable substrates. ■ High and low temperature resistance, impact resistance, aging resistance. ■ Good electrical insulation performance.