Ancham technology of adhesives helps our customers meet some of the more complex challenges

High thermal conductivity, heat curing , can form a tough and strong structural bond, with excellent anti-peel and impact resistance. After Full cure time, it has good heat shock resistance, excellent mechanical and electrical properties, and can resist a variety of solvents and chemicals.

■ Thermal conductivity 4.0W/m·K. 
■ one-component thixotropic paste. 
■ Resistance to mechanical impact. 
■ Excellent resistance to high temperature and environmental aging. 
■ Excellent water and solvent resistance. 
■ Compliant with RoHS, REACH, and halogen regulations.