Ancham technology of adhesives helps our customers meet some of the more complex challenges

At room temperature, it reacts and solidifies with moisture in the air, forming an elastic colloid with strong structural bonds after solidification. It has a high thermal conductivity of 2.7W/m·K and exhibits thixotropy, making it suitable for manual or automatic glue application processes. There will be no collapse or sagging during the glue application process.

■ Thermal conductivity 2.7W/m·K.
■ Has thixotropy.
■ Non-corrosive to metals.
■ Short surface drying time, low odor during curing process.
■ Excellent adhesion to most substrates.
■ Excellent high and low temperature resistance, excellent mechanical and chemical stability.
■ RoHS and Reach compliant.