Two-component silicone potting compound, fast curing at high temperature, low stress cured object, good flexibility. Provide 2.5W/m·K thermal conductivity, good electrical insulation properties, good temperature and weather resistance. Can realize automatic production, designed for electronic potting.
■ Thermal conductivity 2.5W/m·K. ■ Low contact thermal resistance. ■ Low stress. ■ Excellent environmental aging resistance and high and low temperature resistance. ■ Flame retardant in accordance with UL94-V0. Halogen free, RoHS, REACH compliant.
| Product Model | AS42(00) |
| Color | Light grey |
| 1:1 | |
| 6000±1000 mPa.s @ 25℃ |
|
| 65±10 Shore 00 |
|
| 4~6h Initial Curing Time @ 25℃ 24~48h Complete Curing Time @ 25℃ 20~30min Complete Curing Time @ 80℃ |
|
| 2.5W/m·K |