Ancham technology of adhesives helps our customers meet some of the more complex challenges

Two-component silicone thermally conductive gap filler that cures to a flexible gel at room or high temperatures. Provides 2.0W/m·K thermal conductivity and low thermal resistance. Suitable for thermal conduction of heat generating devices in industrial, automotive, computing, communication, LED and other fields.

■ Thermal conductivity 2.0W/m·K.
■ Low stress, protect electronic components.
■ Excellent high and low temperature resistance.
■ Excellent electrical insulation properties.
■ UL94-V0, RoHS compliant.