AP9101 is a PUR hot-melt adhesive that polymerizes with moisture in the air, solidifying to form a high-strength colloid. After application, it has good adhesive strength in the initial curing stage and a relatively long opening time. After complete curing, it has excellent elongation and structural durability. Excellent cold and hot shock resistance, used for bonding various substrates, suitable for structural pressing and electronic assembly applications in industrial production.
■ Single component moisture curing with 100% solid content. ■ The opening time is relatively long, the operability is good, and it is suitable for automated gluing processes. ■ High initial strength and fast curing speed. ■ Good resistance to cold and hot shocks, humidity, and chemical properties. ■ Excellent resistance to mechanical impact and environmental aging. ■ Suitable for bonding multiple substrates; Compliant with RoHS, REACH, halogen-free.
Product Model | AP9101 |
Color | Clear yellowish/ Black |
4000~6000 100℃ |
|
80±5A | |
2~4min 25℃ |
|
≥1300% | |
11MPa PC/PC |