Ancham technology of adhesives helps our customers meet some of the more complex challenges

AP9161 is a PUR hot-melt adhesives that solidifies with moisture to form a high-strength polyurethane colloid. It is designed for structural assembly in electronic digital devices.
AP9161 has a relatively long opening time and can achieve good adhesive strength during the initial curing stage. After complete curing, it has high elongation and adhesive toughness, excellent resistance to cold and hot impacts, and moisture resistance. Suitable for bonding various substrates such as plastics, metals, ceramics, etc.

■ Single component moisture curing with 100% solid content.
■ The opening time is relatively long, the operability is good, and it is suitable for automated gluing processes.
■ High adhesive strength and fast curing speed.
■ Resistance to cold and hot shocks, and moisture resistance.
■ Excellent resistance to mechanical impact and environmental aging.
■ Suitable for bonding multiple substrates; Compliant with RoHS, REACH, halogen-free.