Ancham technology of adhesives helps our customers meet some of the more complex challenges

AP9165 is a PUR hot-melt adhesive that polymerizes when in contact with moisture in the air, resulting in higher adhesive strength after the curing process is completed. Once the adhesive line begins to solidify after application, it can provide good initial strength, and then undergo secondary moisture curing to form an adhesive with excellent elongation and structural durability. Compared to traditional hot melt adhesive materials, AP9165 hot melt adhesive has a lower content of volatile organic compounds (VOCs).
AP9165 is designed for the bonding and sealing of smart electronic product screens, structural components, and components, suitable for various plastic and metal materials.

■ Single component, 100% solid content.
■ Short holding pressure, rapid curing, and high initial strength.
■ Excellent resistance to mechanical impact, drop, and environmental aging.
■ Suitable for bonding various metal and plastic materials.
■ Suitable for automatic or manual assembly lines.
■ Compliant with ROHS, Reach, halogen-free.