One-component epoxy adhesive, heat-cured, creates a tough and strong structural bond with excellent peel and impact resistance. After curing, it has good thermal shock resistance, mechanical and electrical properties, and can resist a variety of solvents and chemicals. Bonding of metals, glass, ceramics and plastics.
■ Thermal conductivity: 5.0W/mk. ■ Single component, 100% solid content. ■ Thixotropic paste, medium and high temperature rapid curing; High thermal conductivity, excellent high temperature resistance. ■ Excellent resistance to mechanical impact and environmental aging; Good water and solvent resistance. ■ Strong adhesion performance. ■ Compliant with ROHS, Reach, halogen-free.