One-component epoxy resin adhesive with medium and high temperature fast curing, high adhesion and high bonding strength. It has significant high and low temperature resistance, a wide range of temperature resistance, and excellent bonding properties to hard materials such as metal and metal, metal and ceramic, metal and some plastics under high temperature conditions.
■ One-component, medium and high temperature fast curing. ■ High bonding strength and wide temperature resistance. ■ Low water absorption. ■ Excellent heat resistance. ■ Good electrical insulation performance.