One-component epoxy adhesive with high thixotropy and good vertical flow resistance. Fast curing at 80°C to form a ductile adhesive layer with high bonding strength. It is suitable for bonding metal to metal, metal to ceramic, metal to glass, metal to plastic, and has better bonding and fixing effect on temperature-sensitive components.
■ One-component, fast curing. ■ Good toughness, high bonding strength. ■ High thixotropy, anti-vertical flow. ■ High peeling strength and tensile shear strength. ■ Excellent electrical insulation performance. ■ High temperature and humidity resistance.