One-component epoxy adhesive, fast curing at 80°C, does not damage components, and has excellent adhesion to metals and plastics. Good storage stability and long dispensing operation time.
■ One-component, low temperature fast curing. ■ High bonding strength. ■ High and low temperature resistance, suitable for SMT reflow soldering/wave soldering process. ■ Excellent impact resistance and aging resistance. ■ Excellent electrical insulation performance.