One-component epoxy adhesive, fast curing at 80°C, does not damage components, and has excellent adhesion to metals and plastics. Good storage stability and long dispensing operation time.
■ One-component, low temperature fast curing. ■ High bonding strength. ■ High and low temperature resistance, suitable for SMT reflow soldering/wave soldering process. ■ Excellent impact resistance and aging resistance. ■ Excellent electrical insulation performance.
Product Model | AE1101 |
Color | Black |
80±5D | |
20000±5000 25℃ |
|
5~10min/ 80℃ |
|
≥20MPa | |
6 months/-5~-10℃ |