Two-component thermally conductive potting silicone adhesive cured at room temperature or heat with good leveling. Low stress, no shelling caused by alternating hot and cold. 2.5W/mk thermal conductivity, excellent insulation performance, suitable for packaging protection of precision electronic devices, smooth surface after potting, no volatiles generation.
■ Thermal conductivity: 2.5W/mk. ■ 100% solid, no exudate after curing. ■ Low stress, more effective protection of electronic components and chips. ■ Excellent environmental aging resistance and high and low temperature resistance. ■ Complies with UL94-V0. ■ Compliant with ROHS, Reach, halogen-free.