Two-component thermally conductive potting silicone adhesive cured at room temperature or heat with good leveling. Low stress, no shelling caused by alternating hot and cold. 2.5W/mk thermal conductivity, excellent insulation performance, suitable for packaging protection of precision electronic devices, smooth surface after potting, no volatiles generation.
■ Thermal conductivity: 2.5W/mk. ■ 100% solid, no exudate after curing. ■ Low stress, more effective protection of electronic components and chips. ■ Excellent environmental aging resistance and high and low temperature resistance. ■ Complies with UL94-V0. ■ Compliant with ROHS, Reach, halogen-free.
Product Model | AS42(25) |
Color | khaki |
Sh00 65±10 | |
6000±1000 25℃ |
|
25℃/24~48h 80℃/20~30min |
|
2.5±0.1W/m.k |