Ancham technology of adhesives helps our customers meet some of the more complex challenges

Two-component thermally conductive potting silicone adhesive cured at room temperature or heat with good leveling. Low stress, no shelling caused by alternating hot and cold.
2.5W/mk thermal conductivity, excellent insulation performance, suitable for packaging protection of precision electronic devices, smooth surface after potting, no volatiles generation.

■ Thermal conductivity: 2.5W/mk.
■ 100% solid, no exudate after curing.
■ Low stress, more effective protection of electronic components and chips.
■ Excellent environmental aging resistance and high and low temperature resistance.
■ Complies with UL94-V0.
■ Compliant with ROHS, Reach, halogen-free.