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Ancham technology of adhesives helps our customers meet some of the more complex challenges

AS42(25)

Product Overview

Two-component thermally conductive potting silicone adhesive cured at room temperature or heat with good leveling. Low stress, no shelling caused by alternating hot and cold.
2.5W/mk thermal conductivity, excellent insulation performance, suitable for packaging protection of precision electronic devices, smooth surface after potting, no volatiles generation.

Product Features

■ Thermal conductivity: 2.5W/mk.
■ 100% solid, no exudate after curing.
■ Low stress, more effective protection of electronic components and chips.
■ Excellent environmental aging resistance and high and low temperature resistance.
■ Complies with UL94-V0.
■ Compliant with ROHS, Reach, halogen-free.
Product parameters
Parameter Specification
Product Model AS42(25)
Color khaki
Sh00 65±10
6000±1000
25℃
25℃/24~48h
80℃/20~30min
2.5±0.1W/m.k
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