Two-component thermally conductive silicone adhesive, cured at room temperature or heat, no stress on electronic components. It can reduce the thermal resistance and facilitate heat conduction.
■ Thermal conductivity: 4.0W/mk. ■ 100% solid, no exudate after curing. ■ Low stress. ■ Excellent high and low temperature resistance, excellent weather resistance, radiation resistance and superior dielectric properties. ■ Complies with UL94-V0. ■ ROHS compliant.