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AS42(04)

Product Overview

Two-component thermally conductive silicone adhesive, cured at room temperature or heat, no stress on electronic components. It can reduce the thermal resistance and facilitate heat conduction.

Product Features

■ Thermal conductivity: 4.0W/mk.
■ 100% solid, no exudate after curing.
■ Low stress.
■ Excellent high and low temperature resistance, excellent weather resistance, radiation resistance and superior dielectric properties.
■ Complies with UL94-V0.
■ ROHS compliant.
Product parameters
Parameter Specification
Product Model AS42(04)
Color Khaki
1:1
Sh00 80±5
Paste
25℃/24~48h
80℃/20~30min
4.0±0.1W/m.k
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