Polyurethane reactive hot melt adhesive, moisture curing, used for structural assembly of electronic digital equipment. Long opening time, high bonding strength, high elongation and bonding toughness, excellent resistance to hot and cold shock and moisture resistance. It is suitable for a variety of substrates such as plastics, metals, ceramics, etc.
■ One-component moisture curing, 100% solid content. ■ Long opening hours. ■ High bonding strength and fast curing speed. ■ Cold and heat shock resistance, moisture resistance. ■ Excellent resistance to mechanical impact and environmental aging resistance. ■ RoHS, REACH, halogen-free.
|Color||Creamy white / Black|