Ancham synthesis technology of adhesives helps our customers meet some of the more complex challenges in the industry

Product Overview

Product Overview

One-component gap filling thermal conductive materials, formed with the shape of the structure, with excellent structural applicability and surface conformability characteristics of structural parts, and sufficient gap filling. With good insulation withstand voltage characteristics and temperature stability, safe and reliable.

Product Applications

Applied to the heat sink bottom or frame, high speed hard drive, micro heat pipe heat sink, automotive engine control device, semiconductor automatic testing equipment. Widely used in telecommunication equipment such as network terminal, storage equipment, LED display backlight tube, consumer electronics power devices, security equipment, instruments, electrical, automotive electronics and other industries.
Product List
Product Model Color Hardness Viscosity(cps) Curing Type Thermal Conductivity More Parameters
AS3720 Light grey Sh00 70PasteMicro Cross-Linked2.0W/m.k Detailed introduction
AS3730 Wathet Sh00 70PasteMicro Cross-Linked3.0W/m.k Detailed introduction
AS3740 Pink Sh00 70PasteMicro Cross-Linked4.0W/m.k Detailed introduction

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