Mainly used in all kinds of CSP, BGA bottom filling, can provide BGA or CSP elements with excellent mechanical impact protection and aging impact protection, good flowablity at room temperature.
CSP element for medium and small gaps.
Product Model | Color | Hardness | Viscosity(cps) | Tg Temperature | Curing Type | Shelf Life | More Parameters |
---|---|---|---|---|---|---|---|
AE1401 | Transparent / Black | 75D | 300~500 | 125°C | 10min/130°C | 6months/-10~0°C | Detailed introduction |
AE1402 | Transparent / Black | 60D | 900~1200 | 48°C | 10min/100°C | 6months/-10~0°C | Detailed introduction |
AE1403 | Translucent / Black | 70D | 1500~2500 | 48°C | 10min/100°C | 6months/-10~0°C | Detailed introduction |