In the era of high-performance computing, CPU cooling has become a key factor in determining the performance of computers. The traditional thermal conductive materials have the points of high thermal resistance, easy to dry out, and inconvenient construction, which restrict the full play of chip performance. Ancham AS3702 thermal grease, with its thermal conductivity, stable characteristics of never curing, and excellent construction adaptability, brings breakthrough solutions to the field of CPU cooling.
When game players encounter CPU downclocking in fierce battles, when video creators are faced with high processor temperatures during rendering tasks, and when data center servers frequently protection mechanisms due to insufficient cooling – these common phenomena all point to the same core technical pain point: the performance limitations of thermal conduction materials. This paper will delve into how Ancham New Materials, through technological innovation, assists in meeting the cooling needs of all scenarios, from enthusiasts to industrial-grade.
一、Industry pain points of CPU cooling
1. Thermal conductivity efficiency decay: Traditional silicone grease is prone to cracking and powdering after six months of use, leading to a decrease in thermal conductivity performance of more than 30%;
2. Difficult construction: Conventional materials have the risk of flowing, which can easily pollute the surrounding precision components of the CPU.
3. Lack of long-term reliability: under temperature cycle changes, ordinary silicone grease will gradually lose its interfacial contact capability;
4. Cheap-quality silicone grease: low thermal conductivity of low-quality silicone grease, not only has poor cooling effect, but also may damage the equipment due to component problems if used for a time;
5. Replacement and upgrade of equipment such as CPU: the power and heat dissipation of new equipment may be different from before, and the old silicone grease is not matched, so it is necessary to replace with the appropriate silicone grease to make the new equipment play the best performance.
二、Breakthrough solution of Ancham AS3702
1. Precise thermal conductivity performance
With a thermal conductivity coefficient of 2.5W/m·K and low thermal resistance characteristics, AS302 can effectively fill the micro-gaps between the CPU and the cooler, increasing the efficiency of heat transfer by 40%.
2. Permanent flexibility
A unique non-curing formula, it maintains a paste-like flexible state under working conditions from -50℃ to 200℃. Even after 200 thermal cycle tests, it still maintains 99% of its original thermal conductivity performance, completely solving the industry problem of traditional silicone grease drying and failing.
3. Smart construction experience
The thixotropic characteristics ensure precise positioning after dispensing, whether it's manual brushing or automated dotting, achieving thin-layer coverage with an accuracy of 0.1mm. The white paste provides excellent construction visibility, effectively avoiding uneven coating or missed coating situations.
4. A safety guarantee
Certified by RoHS and REACH, it contains no metal particles or corrosive components. Its superior electrical insulation performance (dielectric strength > 5kVmm) provides double protection for high-density packaged CPUs.
三、Technical Upgrade Guide
For CPU assembly users:
1. Gently stir before use to restore the optimal paste state
2. Use "X pattern" or "dot pattern" method
3. Recommended coating thickness of 0.1-0.15mm
4. Regular maintenance and replacement (in extreme usage environments
Ancham® AS3702 is redefining the new benchmark of CPU cooling—this is not only a breakthrough in material technology, but also continuous exploration of the limits of computing performance. From overclocking enthusiasts to enterprise-level data centers, from gaming consoles to industrial computers, we provide chip-level calm protection for scenario that needs a reliable cooling solution.
