Polyurethane reactive hot melt adhesive, room temperature moisture curing, short opening time, no pressure holding, good bonding strength in the initial curing stage, suitable for automated rapid assembly process. Solvent-free, odorless, fast curing speed, and high bonding strength, high elongation at break, strong toughness, effectively guarantee the reliability of electronic products. Suitable for plastic, metal, glass and other materials, suitable for structural lamination and electronic assembly applications in industrial production.
■ Fast curing speed and high bonding strength. ■ Excellent resistance to cold and hot shock, moisture resistance and chemical solvents. ■ Excellent resistance to mechanical impact and environmental aging resistance. ■ Suitable for bonding a variety of substrates. ■ RoHS, REACH, halogen-free.
|Color||Creamy white / Black|