Two-component room temperature curing polyurethane insulating encapsulant, heated for fast curing. Excellent chemical resistance, excellent flexibility at low temperatures, protection of stress-sensitive electronic components, excellent adhesion to plastics, metals and glass, low and stable dielectric constant.
■ Sealing of automotive sensors, body electronic ECUs, and automotive electronic device components. ■ Potting of antennas and signal transceivers of communication equipment. ■ Protection of stress-sensitive chips or magnetic components in consumer electronic appliances.
Product Model | Color | Mixing Ratio | Viscosity(cps) | Operation time 25℃ | Tensile Strength | Insulation Strength(AC) | More Parameters |
---|---|---|---|---|---|---|---|
AP83(26) | Black | 100:13.3 | 3000±1000 25℃ | 10~15min | 1.1MPa | ≥20kV/mm | Detailed introduction |
AP83(35) | Black | 5:1 | 2500±1000 25℃ | 30/60min | ≥0.8MPa | ≥20kV/mm | Detailed introduction |
AP83(65) | Black | 100:16 | 1100±300 25℃ | 40~50min | 2.5MPa | ≥20kV/mm | Detailed introduction |