Ancham technology of adhesives helps our customers meet some of the more complex challenges

AP9133 is a PUR hot-melt adhesives that solidifies at room temperature with moisture. It has a short opening time and is pressure free. During the initial curing stage, it has good adhesive strength and is suitable for automated rapid assembly processes.
AP9133 is solvent-free, odorless, has a fast curing speed, high adhesive strength, high fracture elongation, and strong toughness, effectively ensuring the long-term reliability of electronic products. This product is suitable for bonding including plastic, metal glass and other widely used materials are suitable for structural pressing and electronic assembly applications in industrial production.

■ Fast curing speed and high adhesive strength.
■ Excellent resistance to cold and hot shocks, humidity, and chemical solvents.
■ Excellent resistance to mechanical impact and environmental aging.
■ Suitable for bonding multiple substrates.
■ Compliant with RoHS, REACH, halogen-free.