Ancham technology of adhesives helps our customers meet some of the more complex challenges

One-component high-temperature rapid vulcanization, with excellent conductivity and excellent flexibility after vulcanization, excellent compression and rebound performance, and no collapse of the adhesive layer cross-section. It has good adhesion to most conventional substrates such as conductive coating films, die casting, and metal coatings. A substrate that can be used for metal, electroplating, or chromate treatment, suitable for FIP on-site formed electromagnetic sealing gaskets.

Electrostatic shielding applications in fields such as communication equipment, telecommunications base stations, acoustic and optoelectronic modules, civilian radars, industrial PDA handheld terminals, and consumer electronics.